Thermoelectric micro-cooler for hot-spot thermal management

Peng Wang, Avram Bar-Cohen, Bao Yang, Gary L. Solbrekken, Yan Zhang, Ali Shakouri

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

15 Scopus citations

Abstract

Driven by shrinking feature sizes, microprocessor "hot-spots" - with their associated high heat flux and sharp temperature gradients - have emerged as the primary "driver" for on-chip thermal management of today's IC technology. Solid state thermoelectric micro-coolers offer great promise for reducing the severity of on-chip "hot-spots", but the theoretical cooling potential of these devices, fabricated on the back of the silicon die in an IC package, has yet to be determined. The results of a three-dimensional electro-thermal finite-element modeling study of such a micro-cooler are presented. Attention is focused on the hot-spot temperature reductions associated with variations in micro-cooler geometry, chip thickness, and chip doping concentration, along with the parasitic Joule heating effects from the electrical contact resistance and current flow through the silicon. The modeling results help to define the optimum solid-state cooling configuration and reveal that, for the conditions examined, nearly 80% of the hot-spot temperature rise of 2.5°C can be removed from a 70μm × 70μm, 680W/cm 2 hot-spot on a 50μm thick silicon die with a single micro-cooler.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages2157-2167
Number of pages11
StatePublished - 2006
Externally publishedYes
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 17 Jul 200522 Jul 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/07/0522/07/05

Keywords

  • Cooling
  • Hot-spot
  • Micro-cooler
  • SiGe/Si
  • Superlattice
  • Thermal management
  • Thermionic
  • Thermoelectric

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