Thermal management of high heat flux nanoelectronic chips

A. Bar-Cohen; P. Wang; E. Rahim

doi:10.1007/BF02915748

Thermal management of high heat flux nanoelectronic chips

A. Bar-Cohen, P. Wang, E. Rahim

Research output: Contribution to journal › Article › peer-review

73 Scopus citations

Abstract

Driven by the continuing Moore's Law evolution in chip technology, power dissipation of nanoelectronics chips could exceed 300W, with heat fluxes above 150W/cm², within the next few years, along with localized, sub-millimeter zones with heat fluxes in excess of 1kW/cm². New and novel cooling techniques, with the ability to selectively cool sub-millimeter "sun spots" while providing effective global cooling for high heat flux chips are needed. Several promising approaches, including the application of miniaturized silicon and BiTe thermoelectric coolers and direct cooling with dielectric liquids through thin film evaporation, will be described.

Original language	English
Pages (from-to)	48-52
Number of pages	5
Journal	Microgravity Science and Technology
Volume	19
Issue number	3-4
DOIs	https://doi.org/10.1007/BF02915748
State	Published - 2007
Externally published	Yes

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abstract = "Driven by the continuing Moore's Law evolution in chip technology, power dissipation of nanoelectronics chips could exceed 300W, with heat fluxes above 150W/cm2, within the next few years, along with localized, sub-millimeter zones with heat fluxes in excess of 1kW/cm2. New and novel cooling techniques, with the ability to selectively cool sub-millimeter {"}sun spots{"} while providing effective global cooling for high heat flux chips are needed. Several promising approaches, including the application of miniaturized silicon and BiTe thermoelectric coolers and direct cooling with dielectric liquids through thin film evaporation, will be described.",

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Thermal management of high heat flux nanoelectronic chips

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