Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems

Yun Soung Kim, Jesse Lu, Benjamin Shih, Armen Gharibans, Zhanan Zou, Kristen Matsuno, Roman Aguilera, Yoonjae Han, Ann Meek, Jianliang Xiao, Michael T. Tolley, Todd P. Coleman

Research output: Contribution to journalArticlepeer-review

50 Scopus citations

Abstract

Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with “PI islands” to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring.

Original languageEnglish
Article number1701312
JournalAdvanced Materials
Volume29
Issue number39
DOIs
StatePublished - 18 Oct 2017
Externally publishedYes

Keywords

  • adhesive electronics
  • reflow soldering
  • scalable manufacturing
  • soft robotics
  • stretchable electronics

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