On-chip hot spot remediation with miniaturized thermoelectric coolers

Avram Bar-Cohen, Peng Wang

Research output: Contribution to journalArticlepeer-review

49 Scopus citations

Abstract

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in chip heat flux and growing concern over the emergence of on-chip "hot spots" in microprocessors, along with such high flux regions in power electronic chips and LED's. Miniaturized thermoelectric coolers (μ-TEC's) are a most promising cooling technique for the remediation of such hot spots. This paper presents a comprehensive review of recent advances in novel applications of superlattice, mini-contact, and silicon-based miniaturized thermoelectric coolers in reducing the severity of on-chip hot spots.

Original languageEnglish
Pages (from-to)S351-S359
JournalMicrogravity Science and Technology
Volume21
Issue numberSUPPL. 1
DOIs
StatePublished - Aug 2009
Externally publishedYes

Keywords

  • Electronic cooling
  • Hot spot cooling
  • Thermal management
  • Thermoelectric cooler

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