Nickel in Photocatalysis

C. B. Kelly, J. K. Matsui, J. P. Phelan, A. Gutierrez Bonet, S. B. Lang, G. A. Molander

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

Robust methods to forge C-C bonds selectively are treasured by the chemical community because of the inherent value of such processes in the convergent construction of complex molecules and the notorious challenges associated with creating such linkages. The advent of cross-coupling technologies (e.g., Suzuki, Negishi, and Heck processes) has revolutionized how synthetic chemists establish C(sp2)-C(sp2) bonds. However, the mechanistic features that make these transition-metal-catalyzed processes ideal for this type of transformation are the same ones that limit their abilities to involve C(sp3)-hybridized species. In this chapter, a recently developed solution to the underlying challenge of engaging C(sp3)-hybridized nucleophiles in cross coupling is outlined: nickel/photoredox dual catalysis. By proceeding through radical intermediates, the enthalpic penalty for two-electron transmetalation can be side-stepped, and cross coupling can proceed under mild, functional-group-tolerant conditions. Several variants of this dual catalytic process are presented which, taken together, demonstrate the breadth and scope of this new cross-coupling paradigm.

Original languageEnglish
Title of host publicationCatalytic Reduction in Organic Synthesis 2
EditorsM.C. Bagley
PublisherGeorg Thieme Verlag
Pages339-370
Number of pages32
Edition6
ISBN (Electronic)9783132417021
DOIs
StatePublished - 2018

Publication series

NameScience of Synthesis
Number6
Volume2018
ISSN (Print)2510-5469
ISSN (Electronic)2566-7297

Keywords

  • Cross coupling
  • Hydrogen-atom transfer
  • Nickel catalysis
  • Photocatalysis
  • Photoredox
  • Radicals
  • Single-electron transfer
  • Single-electron transmetalation
  • Visible light

Fingerprint

Dive into the research topics of 'Nickel in Photocatalysis'. Together they form a unique fingerprint.

Cite this