Erratum: "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices" (IEEE Transactions on Components and Packaging Technologies (2007) vol. 30 (3) (432-438))

Bao Yang; Peng Wang; Avram Bar-Cohen

doi:10.1109/TCAPT.2007.909249

Erratum: "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices" (IEEE Transactions on Components and Packaging Technologies (2007) vol. 30 (3) (432-438))

Bao Yang, Peng Wang, Avram Bar-Cohen

Research output: Contribution to journal › Comment/debate

Original language	English
Pages (from-to)	889
Number of pages	1
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	30
Issue number	4
DOIs	https://doi.org/10.1109/TCAPT.2007.909249
State	Published - Dec 2007
Externally published	Yes

Access to Document

10.1109/TCAPT.2007.909249

Cite this

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title = "Erratum: {"}Mini-contact enhanced thermoelectric cooling of hot spots in high power devices{"} (IEEE Transactions on Components and Packaging Technologies (2007) vol. 30 (3) (432-438))",

author = "Bao Yang and Peng Wang and Avram Bar-Cohen",

year = "2007",

month = dec,

doi = "10.1109/TCAPT.2007.909249",

language = "English",

volume = "30",

pages = "889",

journal = "IEEE Transactions on Components and Packaging Technologies",

issn = "1521-3331",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

Erratum: "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices" (IEEE Transactions on Components and Packaging Technologies (2007) vol. 30 (3) (432-438)). / Yang, Bao; Wang, Peng; Bar-Cohen, Avram.
In: IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 4, 12.2007, p. 889.

Research output: Contribution to journal › Comment/debate

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T1 - Erratum

T2 - "Mini-contact enhanced thermoelectric cooling of hot spots in high power devices" (IEEE Transactions on Components and Packaging Technologies (2007) vol. 30 (3) (432-438))

AU - Yang, Bao

AU - Wang, Peng

AU - Bar-Cohen, Avram

PY - 2007/12

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DO - 10.1109/TCAPT.2007.909249

M3 - Comment/debate

AN - SCOPUS:36849073628

SN - 1521-3331

VL - 30

SP - 889

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 4

ER -