Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers

Peng Wang; Avram Bar-Cohen; Bao Yang

Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers

Peng Wang, Avram Bar-Cohen, Bao Yang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Thermal management of microprocessors has become an increasing challenge in recent years because of localized high flux hotspots which can not be effectively removed by conventional cooling techniques. This paper describes the novel use of the silicon chip itself as thermoelectric microcooler to suppress the hotspot temperature. A three-dimensional analytical thermal model of the silicon chip, including localized silicon thermoelectric cooling, thermoelectric heating, Joule heating, hotspot heating, background heating, and conductive/convective cooling on the back of the silicon chip, is developed and used to predict the on-chip hotspot cooling performance. The effects of chip thickness, microcooler size, doping concentration and parasitic Joule heating from the electric contact resistance on hotspot cooling are investigated in details.

Original language	English
Title of host publication	Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Print)	0791837904, 9780791837900
State	Published - 2006
Externally published	Yes
Event	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States Duration: 5 Nov 2006 → 10 Nov 2006

Publication series

Name	American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
ISSN (Print)	1071-6947

Conference

Conference	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Country/Territory	United States
City	Chicago, IL
Period	5/11/06 → 10/11/06

Cite this

Wang, P., Bar-Cohen, A., & Yang, B. (2006). Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP). American Society of Mechanical Engineers (ASME).

Wang, Peng ; Bar-Cohen, Avram ; Yang, Bao. / Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers. Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

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title = "Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers",

abstract = "Thermal management of microprocessors has become an increasing challenge in recent years because of localized high flux hotspots which can not be effectively removed by conventional cooling techniques. This paper describes the novel use of the silicon chip itself as thermoelectric microcooler to suppress the hotspot temperature. A three-dimensional analytical thermal model of the silicon chip, including localized silicon thermoelectric cooling, thermoelectric heating, Joule heating, hotspot heating, background heating, and conductive/convective cooling on the back of the silicon chip, is developed and used to predict the on-chip hotspot cooling performance. The effects of chip thickness, microcooler size, doping concentration and parasitic Joule heating from the electric contact resistance on hotspot cooling are investigated in details.",

author = "Peng Wang and Avram Bar-Cohen and Bao Yang",

year = "2006",

language = "English",

isbn = "0791837904",

series = "American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP",

publisher = "American Society of Mechanical Engineers (ASME)",

booktitle = "Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging",

note = "2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 ; Conference date: 05-11-2006 Through 10-11-2006",

}

Wang, P, Bar-Cohen, A & Yang, B 2006, Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers. in Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, American Society of Mechanical Engineers (ASME), 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006, Chicago, IL, United States, 5/11/06.

Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers. / Wang, Peng; Bar-Cohen, Avram; Yang, Bao.
Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Wang, Peng

AU - Bar-Cohen, Avram

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N2 - Thermal management of microprocessors has become an increasing challenge in recent years because of localized high flux hotspots which can not be effectively removed by conventional cooling techniques. This paper describes the novel use of the silicon chip itself as thermoelectric microcooler to suppress the hotspot temperature. A three-dimensional analytical thermal model of the silicon chip, including localized silicon thermoelectric cooling, thermoelectric heating, Joule heating, hotspot heating, background heating, and conductive/convective cooling on the back of the silicon chip, is developed and used to predict the on-chip hotspot cooling performance. The effects of chip thickness, microcooler size, doping concentration and parasitic Joule heating from the electric contact resistance on hotspot cooling are investigated in details.

AB - Thermal management of microprocessors has become an increasing challenge in recent years because of localized high flux hotspots which can not be effectively removed by conventional cooling techniques. This paper describes the novel use of the silicon chip itself as thermoelectric microcooler to suppress the hotspot temperature. A three-dimensional analytical thermal model of the silicon chip, including localized silicon thermoelectric cooling, thermoelectric heating, Joule heating, hotspot heating, background heating, and conductive/convective cooling on the back of the silicon chip, is developed and used to predict the on-chip hotspot cooling performance. The effects of chip thickness, microcooler size, doping concentration and parasitic Joule heating from the electric contact resistance on hotspot cooling are investigated in details.

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M3 - Conference contribution

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SN - 0791837904

SN - 9780791837900

T3 - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging

PB - American Society of Mechanical Engineers (ASME)

T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006

Y2 - 5 November 2006 through 10 November 2006

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Wang P, Bar-Cohen A, Yang B. Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME). 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

Analytical modleing of on-chip hotspot cooling using silicon thermoelectric microcoolers

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