@article{0c14642ba6ba44a3be90206fe59b0296,
title = "An analytical model of strain isolation for stretchable and flexible electronics",
abstract = "One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.",
author = "H. Cheng and J. Wu and M. Li and Kim, \{D. H.\} and Kim, \{Y. S.\} and Y. Huang and Z. Kang and Hwang, \{K. C.\} and Rogers, \{J. A.\}",
note = "Funding Information: The support from NSF (Grant Nos. DMI-0328162 and ECCS-0824129) is acknowledged. K.C. Hwang acknowledges the support from NSFC, Ministry of Education of China, and National Basic Research Program of China (973 Program, Grant No. 2007CB936803). The first and second authors contributed equally.",
year = "2011",
month = feb,
day = "7",
doi = "10.1063/1.3553020",
language = "English",
volume = "98",
journal = "Applied Physics Letters",
issn = "0003-6951",
publisher = "American Institute of Physics",
number = "6",
}