A novel process for preparing PZT thick films

A. L. Ding, X. Y. He, P. S. Qui, S. J. Wang, W. G. Luo, H. L.W. Chan, P. Wang, C. L. Choy

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

A novel method for preparing PZT thick films has been developed, which integrated some advantages of common-used processes. Comparing with conventional methods, the present technology can prevent cracks, improve morphologies and properties in films, and increase an achievable thickness. The films show a dense structure and therefor uniform properties, that are comparable with those in bulk ceramics. PZT film of 3.5 μm thickness has a large remanent polarization of 44μC/cm2, small coercive field of 50 kV/cm, large dielectric constant of 2000 and small dielectric loss tanδ of 0.04, respectively.

Original languageEnglish
Pages515-518
Number of pages4
StatePublished - 2000
Externally publishedYes
Event12th IEEE International Symposium on Applications of Ferroelectrics - Honolulu, HI, United States
Duration: 21 Jul 20002 Aug 2000

Conference

Conference12th IEEE International Symposium on Applications of Ferroelectrics
Country/TerritoryUnited States
CityHonolulu, HI
Period21/07/002/08/00

Keywords

  • Alkoxide
  • Hydrolytic product
  • PZT
  • Thick film

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