Study Data from Tsinghua University Update Understanding of Electronics Packaging (High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology)

Press/Media

Period	9 Mar 2023

Media coverage

Title	Study Data from Tsinghua University Update Understanding of Electronics Packaging (High Gain and Wideband Antenna-in-package Solution Using Fan-out Technology)
Media name/outlet	Electronics Daily
Country/Territory	United States
Date	9/03/23
URL	ct.moreover.com/?a=50207872372&p=1gw&v=1&x=GO8x0QlevXeLyG0oy8gQKA
Persons	Qian Wang