'Glass substrates to replace 2.5D package in chips in the future'

Press/Media

Period	11 Jun 2024

Media coverage

Title 'Glass substrates to replace 2.5D package in chips in the future'
Media name/outlet ThElec.net
Date 11/06/24
URL thelec.net/news/articleView.html?idxno=4872
Persons Won Hee Lee

Title	'Glass substrates to replace 2.5D package in chips in the future'
Media name/outlet	ThElec.net
Date	11/06/24
URL	thelec.net/news/articleView.html?idxno=4872
Persons	Won Hee Lee